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EN 3475-703-2002 航空航天系列.航空用电缆.试验方法.第703部分:制造商标记的耐久性;德文版本EN3475-703:2002

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【英文标准名称】:Aerospaceseries-Cables,electrical,aircraftuse;Testmethods-Part703:Permanenceofmanufacturer'smarking;GermanversionEN3475-703:2002
【原文标准名称】:航空航天系列.航空用电缆.试验方法.第703部分:制造商标记的耐久性;德文版本EN3475-703:2002
【标准号】:EN3475-703-2002
【标准状态】:现行
【国别】:
【发布日期】:2002-08
【实施或试行日期】:
【发布单位】:欧洲标准学会(EN)
【起草单位】:
【标准类型】:()
【标准水平】:()
【中文主题词】:耐久性;耐用试验;试验;规范(验收);电缆;电缆;制造商标记;多语种的;导电体;电的;飞行器;作标记;电线;航空运输;企业;性能;航空航天运输
【英文主题词】:Aerospacetransport;Airtransport;Aircraft;Cables;Durability;Electriccables;Electricconductors;Electrical;Electricalcords;Endurancetests;Enterprises;Manufacturer'smark;Marking;Multilingual;Performance;Specification(approval);Testing
【摘要】:
【中国标准分类号】:V25
【国际标准分类号】:49_060
【页数】:7P.;A4
【正文语种】:英语


【英文标准名称】:Chemicalanalysisofsilico-chromium.Determinationofphosphoruscontent.Spectrophotometricmethod.
【原文标准名称】:铬硅的化学分析.磷含量测定.分光光度计法
【标准号】:NFA10-504-1986
【标准状态】:现行
【国别】:法国
【发布日期】:1986-01-01
【实施或试行日期】:1986-01-05
【发布单位】:法国标准化协会(AFNOR)
【起草单位】:
【标准类型】:()
【标准水平】:()
【中文主题词】:
【英文主题词】:
【摘要】:
【中国标准分类号】:H13
【国际标准分类号】:77_100
【页数】:5P;A4
【正文语种】:其他


Product Code:SAE J1752/2
Title:Measurement of Radiated Emissions from Integrated Circuits -- Surface Scan Method (Loop Probe Method) 10 MHz to 3 GHz
Issuing Committee:Electromagnetic Compatibility (Emc) Standards
Scope:This SAE Recommended Practice defines a method for evaluating the near field electric or magnetic component of the electromagnetic field at the surface of an integrated circuit (IC). This technique is capable of providing a detailed pattern of the RF sources internal to the IC. The resolution of the pattern is determined by the characteristics of the probes used and the precision of the mechanical probe positioner. The method is usable over the 10 MHz to 3 GHz frequency range with existing probe technology. The probe is mechanically scanned according to a programmed pattern in a plane parallel or perpendicular to the IC surface and the data is computer processed to provide a color-enhanced representation of field strength at the scan frequency. This procedure is applicable to measurements from an IC mounted on any circuit board that is accessible to the scan probe. For comparisons, the standardized test board shall be used. This diagnostic procedure is intended for IC architectural analysis including functional floor plan and power distribution.